Translated Track (Chinese to English and Japanese to English)

Tuesday, November 4, 2008
Morning Session: 8:00 AM - 11:10 AM

TA4 - Microelectronics Packaging in China (Chinese to English Translation)
Chairs: Randy Klein, WC Heraeus – HMTS; Charles Luo, Heraeus Materials Technology Shanghai Ltd.
Session cancelled on October 20 due to visa rejections

Tuesday, November 4, 2008
Afternoon Session: 1:50 PM - 5:40 PM

TP7
Technology Drivers Trends of High Density Packaging for Mobile Electronics (Japanese to English Translation)
Chairs: Kishio Yokouchi, FUJITSU Interconnect Technologies LTD.; Jim Drehle, Robert Lloyd & Associates

The ultra high density packaging technologies for mobile equipment have been achieving a remarkable breakthrough in Japanese industry-wide trend. In this session, High density substrate and assembly reliability will be discussed, regarding 3D, Ultra Thin Packaging for notebook PC and cell phones.

Recent Advance on Board-Level Optical Interconnection (50 mins)
Osamu Mikami, Tokai University

Ultra Thin Packaging Technology for Cell Phones
Takaaki Yoshihiro, NEC Corporation

Packaging Technology for Recent Notebook PCs
Ryo Kanai, Fujitsu Advanced Technologies Limited

Study of Stress to Solder Joint by Underfill Filling
Akira Tanaka, Toshiba Corporation Personal Computer & Network Company

High Reliable Resin Core Bump Technology for 20um Pitch COG (Chip on Glass) Interconnection
Haruki Ito, SEIKO EPSON Corporation