IMAPS 2008 - Program-at-a-Glance

Image courtesy of Natel

Image courtesy of Panasonic Factory Solutions Company of America

Image courtesy of Hesse & Knipps

Images courtesy of:
Natel, Panasonic and Hesse & Knipps.

Program-at-a-Glance

Use the program grid below to quickly access information about IMAPS 2008. Most areas below are linked to the details for each item you are interested in. Or link directly to the Technical Program, PDCs, Poster Sessions, Student Program, Exhibitor Information or GBC.

Sunday, November 2
8:00 am - 5:00 pm	Professional Development Courses
5:00 pm - 6:00 pm	Professional Development Course Reception (Registrants and Instructors Only) Sponsored by Panasonic
Monday, November 3
8:00 am - 5:00 pm	Professional Development Courses
5:00 pm - 7:30 pm	Welcome Reception (All are invited)
	Industry Focused Track	Systems/Design Track	Materials Track	Translated Track	Reliability Track	Advanced Technologies Track
Tuesday, November 4
8:00 am - 11:00 am	Automotive Electronics	Embedded and Integrated Passives	Pb-Free Materials, Solder and Reliability	Microelectronics Packaging in China Cancelled due to visa rejections	Flip-Chip Reliability	3D Packaging and High Density Substrates
11:00 am - 5:00 pm	Exhibit Hall Open
11:15 am - 11:30 am	Annual Business Meeting
11:30 am - 12:00 pm	Awards Ceremony
12:00 pm - 12:45 pm	Keynote Presentation Dr. John C. Zolper, Raytheon
12:45 pm - 1:45 pm	Lunch Kiosks (Food not provided by IMAPS)
	Industry Focused Track	Systems/Design Track	Materials Track	Signal Integrity Track	Reliability Track	Advanced Technologies Track	Translated Track
1:50 pm - 5:40 pm	Biomedical Electronics	Thermal Management	Ceramic, LTCC, Polymer and Conductive Materials	Microwave and RF Applications	Manufacturing, Outsourcing and Quality Assessment	Flip-Chip Processes	Technology Drivers Trends of High Density Packaging for Mobile Electronics (Japanese to English Translation)
Wednesday, November 5
8:00 am - 11:40 am	Consumer Electronics	Design and Modeling	Pb-Free Solder Materials, RoHS, and Reliability	MEMS and Sensors	Package Reliability I	Wafer Level Packaging / CSP
9:00 am - 5:00 pm	Exhibit Hall Open
11:45 am - 12:30 pm	Keynote Presentation The Honorable Donald L. Carcieri, Governor of Rhode Island
12:30 pm - 1:30 pm	Lunch in the Exhibit Hall (Provided by IMAPS)
	Industry Focused Track	Systems/Design Track	Materials Track	Signal Integrity Track	Reliability Track	Advanced Technologies Track	Interactive Track
1:35 pm - 5:25 pm	Military Applications	Electrical Modeling & Design	Advanced Materials	High Performance Interconnects and Boards	Package Reliability II	Advanced Packaging	Interactive Forum (Poster Session)
2:30 pm - 3:45 pm	Panel Discussion on Alternative Energy (INCLUDED WITH YOUR FULL SYMPOSIUM REGISTRATION)
5:30 pm - 6:45 pm	Global Business Council (GBC) Marketing Forum (INCLUDED WITH YOUR FULL SYMPOSIUM REGISTRATION)
6:50 pm - 7:30 pm	GBC Networking Reception Sponsored by Panasonic
Thursday, November 6
	Industry Focused Track	Packaging Processes Track	Materials Track	Signal Integrity Track	Packaging Processes Track	Advanced Technologies Track
8:00 am - 12:00 pm	Telecom Packaging and Optoelectronics	Wirebonding and Stud Bumping	Underfills, Encapsulants and Adhesives	Packaging for Extreme Environments	Packaging Process Technologies	Emerging Technologies
9:00 am - 12:00 pm	Exhibit Hall Open
9:00 am - 12:00 pm	IMAPS 2009 Booth Selection in the Exhibit Hall